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Cited article:

Study on mechanical and thermal properties of a modified epoxy resin

Junfeng HUANG, Erming HE, Pengxiang CHEN, Yongzhi LI

JNWPU, 39 5 (2021) 978-986

Published online: 2021-12-14

DOI: https://doi.org/10.1051/jnwpu/20213950978

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References

This article has been cited by the following article(s):

Mechanical properties of Sn–Pb based solder joints and fatigue life prediction of PBGA package structure

Jintao He, Yun Ling and Dong Lei
Ceramics International 49 (16) 27445 (2023)
https://doi.org/10.1016/j.ceramint.2023.06.017