Xibei Gongye Daxue Xuebao/Journal of Northwestern Polytechnical University

Cracking mechanism analysis and experimental verification of encapsulated module under high low temperature cycle considering residual stress

Yongzhi LI, Erming HE, Pengxiang CHEN and Menghan YIN

JNWPU, 41 3 (2023) 447-454

Published online: 01 August 2023

DOI: 10.1051/jnwpu/20234130447

Yongzhi LI

Erming HE

Pengxiang CHEN

Menghan YIN

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