Article references

Articles citing this article

The Citing articles tool gives a list of articles citing the current article.
The citing articles come from EDP Sciences database, as well as other publishers participating in CrossRef Cited-by Linking Program. You can set up your personal account to receive an email alert each time this article is cited by a new article (see the menu on the right-hand side of the abstract page).

Cited article:

Cracking mechanism analysis and experimental verification of encapsulated module under high low temperature cycle considering residual stress

Yongzhi LI, Erming HE, Pengxiang CHEN, Menghan YIN

JNWPU, 41 3 (2023) 447-454

Published online: 2023-08-01

DOI: https://doi.org/10.1051/jnwpu/20234130447

This article has been cited by the following article(s):

Epoxy molding compound encapsulation process in IC packaging: a review at wafer and component levels

Ainnur Hanim Othman, Mohd Sharizal Abdul Aziz, Mohammad Hafifi Hafiz Ishak, Muhammad Naqib Nashrudin and Muhammad Aqil Azman
The International Journal of Advanced Manufacturing Technology 142 (7-8) 3281 (2026)
https://doi.org/10.1007/s00170-025-17196-x

Literature Review on Fault Mechanism Analysis and Diagnosis Methods for Main Pump Systems

Wensheng Ma, Shoutao Ma, Zheng Zou, Benyuan Fu, Jinghua Ma, Junjiang Liu and Qi Zhang
Machines 13 (11) 1000 (2025)
https://doi.org/10.3390/machines13111000