Open Access
Issue
JNWPU
Volume 44, Number 2, April 2026
Page(s) 426 - 434
DOI https://doi.org/10.1051/jnwpu/20264420426
Published online 12 June 2026
  1. SAMIR T. Improving wafer temperature uniformity for etch applications[D]. Texas: Texas Tech University, 2003. [Google Scholar]
  2. LEE H J, LEE S H. Numerical evaluation on surface temperature uniformity of multi-zone and single-zone ceramic heaters with the electrostatic chuck[J]. Journal of Mechanical Science and Technology, 2021, 35(8): 3763–3770. [Article] [Google Scholar]
  3. YOON T W, CHO S I, CHOI M, et al. Heat transfer mechanism of electrostatic chuck surface and wafer backside to improve wafer temperature uniformity[J]. Journal of Vacuum Science & Technology B, 2023, 41(4): 14 [Google Scholar]
  4. SUN Yuchun, CHENG Jia, LU Yijia, et al. Investigation on thermal contact resistance of Si-wafer and electrostatic chuck[J]. Chinese Journal of Vacuum Science and Technology, 2016, 36(1): 86–92 (in Chinese) [Google Scholar]
  5. FENG Peng. Research and simulation on heat flow of electrostatic chuck in HDPCVD equipment[D]. Shenyang: Shenyang Ligong University, 2023. (in Chinese) [Google Scholar]
  6. CHEN Haolong, TANG Xinyue, WANG Runhua, et al. Solving multi-media nonlinear transient heat conduction problem based on physics-informed neural networks[J]. Chinese Journal of Theoretical and Applied Mechanics, 2025, 57(1): 89–102 (in Chinese) [Google Scholar]
  7. XU Deyu. Near-field radiative heat transfer modulation mechanism and device prototype based on semiconductor field-effect[D]. Harbin: Harbin Institute of Technology, 2024. (in Chinese) [Google Scholar]
  8. SUN Shizhuang, ZHAO Jinrong. The effect of structure and electrical properties of the mesa on the electrostatic chuck force[J]. Chinese Journal of Vacuum Science and Technology, 2023, 43(4): 305–313 (in Chinese) [Google Scholar]
  9. SUN Shizhuang, ZHAO Jinrong. Influence of wafer material on chuck force of J-R type electrostatic chuck[J]. Chinese Journal of Vacuum Science and Technology, 2023, 43(6): 554–562 (in Chinese) [Google Scholar]
  10. SUN Shizhuang, ZHAO Jinrong. The Influence of electrode structure and wafer material on chuck force of coulomb electrostatic chuck[J]. Chinese Journal of Vacuum Science and Technology, 2023, 43(8): 681–688 (in Chinese) [Google Scholar]
  11. YOON T W, CHOI M, HONG S J. Thermal and electrical analysis of the electrostatic chuck for the etch equipment[J]. IEEE Trans on Semiconductor Manufacturing, 2023, 36(4): 653–665. [Article] [Google Scholar]
  12. ŁACH Ł, SVYETLICHNYY D. Recent progress in heat and mass transfer modeling for chemical vapor deposition processes[J]. Energies, 2024, 17(13): 3267 [Google Scholar]
  13. JALURIA Y, WONG S, JUMAAH O. Modeling and optimization of transport processes in thin film fabrication by chemical vapor deposition[J]. ASME Journal of Heat and Mass Transfer, 2025, 147(11): 111301. [Article] [Google Scholar]
  14. ZHANG Zeming, HUANG Liping, ZHAO Jicong, et al. Simulation of temperature control for electrostatic chuck in plasma etching[J]. Chinese Journal of Vacuum Science and Technology, 2015, 35(10): 1196–1202 (in Chinese) [Google Scholar]
  15. PATRA Umakanta, SAHA Sushantika, DAS Shreyasi, et al. Understanding the role of environment and dielectric capping on the electrical properties of WS2 monolayers grown by chemical vapor deposition technique[J]. Journal of Applied Physics, 2025, 138(17): 174303 [Google Scholar]
  16. ZHANG Hua. The finite element analysis of BOR's electromagnetic scattering problem[D]. Xi'an: Northwestern Polytechnical University, 2006. (in Chinese) [Google Scholar]
  17. HSU K C, YANG J Y, CHEN J Z, et al. Modeling and simulation of heat transfer characteristics of 12-inch wafer on electrostatic chuck[C]//2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, 2015: 304–307. [Google Scholar]

Current usage metrics show cumulative count of Article Views (full-text article views including HTML views, PDF and ePub downloads, according to the available data) and Abstracts Views on Vision4Press platform.

Data correspond to usage on the plateform after 2015. The current usage metrics is available 48-96 hours after online publication and is updated daily on week days.

Initial download of the metrics may take a while.